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Annapurna Labs ASIC Engineer Intern 2027

Sponsor / Host
Amazon (Annapurna Labs)
Degree Level
Bachelor's or Master's
Deadline
2027 internship cycle
Study in
USA
Website
Official Scholarship Website

About the Annapurna Labs ASIC Engineer Internship

The Annapurna Labs ASIC engineer internship is confirmed for the 2027 cycle, and the role is open to students who will graduate in December 2027 or later. If that graduation window matches your studies, you can prepare and apply through Amazon’s careers portal. This position sits inside Amazon’s custom silicon group, where interns work on the chips that power large-scale cloud and machine learning workloads.

As an intern, you help design and verify major blocks of a system-on-chip. The work is hands-on: digital logic design, hardware description languages, and verification on real platforms. It suits students who want practical chip design experience alongside experienced hardware teams.

Who Runs the Internship

Amazon hosts this internship through Annapurna Labs, its custom silicon and networking division. Annapurna designs the specialised processors behind many Amazon Web Services products, including networking and machine learning accelerators. Because the team builds chips end to end, interns get exposure to the full design and verification flow rather than a narrow slice of it.

Study Level and Eligible Fields

The internship targets students in a Bachelor’s or Master’s degree program. Eligible fields include Electrical Engineering, Computer Engineering, Computer Science, or a related discipline. A focus on VLSI, digital design, or computer architecture strengthens your application, though it is listed as preferred rather than mandatory.

How Many Intern Positions Are Offered

The number of intern positions is not specified. Amazon does not state a fixed quota for this role, so treat availability as open until the posting closes. Apply early rather than waiting, because hiring teams often review candidates on a rolling basis.

Who Can Apply

This internship is for current university students on track to graduate in December 2027 or later. You should already have coursework or project experience in digital logic design and computer architecture. Familiarity with a hardware description language such as Verilog, SystemVerilog, or VHDL is expected. The role is based in the USA, so international applicants should confirm work authorisation and visa requirements with the recruiting team.

Pay, Benefits and Duration

The base salary depends on location. Amazon lists these annual ranges for the role:

  • Cupertino, CA: 126,100 – 185,000 USD
  • Austin, TX: 109,700 – 160,000 USD
  • Seattle, WA: 109,700 – 160,000 USD

Beyond base pay, your package can include sign-on payments and restricted stock units (RSUs). Amazon also offers benefits such as health, dental and vision insurance, 401(k) matching, paid time off, and parental leave. Final compensation reflects your experience, qualifications, and work location. The listing does not state the exact internship length, so confirm the duration during recruitment.

Eligibility Requirements

You should meet the following before you apply:

  • Currently enrolled in a Bachelor’s or Master’s program in Electrical Engineering, Computer Engineering, Computer Science, or a related field.
  • A final graduation date of December 2027 or later.
  • Coursework or project experience in digital logic design and computer architecture.
  • Familiarity with Verilog, SystemVerilog, or VHDL.
  • Understanding of combinational and sequential logic, finite state machines, timing, and clocking.

The following experience is preferred and will help your application stand out:

  • Practical semiconductor ASIC design work, including owning end-to-end design of major SOC blocks.
  • Verification across multiple platforms: UVM test bench, FPGA, emulator, software environments, and system testing.
  • A degree focus on VLSI, digital design, or computer architecture.
  • Experience with EDA tools such as Cadence, Synopsys, or equivalent.
  • Scripting in Python, Perl, TCL, or shell for automation and design flows.
  • Prior internship, research, or lab experience in chip design, embedded systems, or hardware development.
  • Strong verbal and written communication skills.

Application Process for the Annapurna Labs ASIC Engineer Internship

Apply online through the official Amazon jobs page for the 2027 internship cycle. The listing does not publish a single fixed closing date, so submit your application as soon as you are ready; roles like this often close once enough strong candidates apply. Prepare a resume that clearly shows your degree program, expected graduation date, and any HDL or chip design projects.

Los Angeles County applicants: Amazon considers qualified applicants with arrest and conviction records under the Los Angeles County Fair Chance Ordinance. If you have a disability and need a workplace accommodation during the application or interview process, you can request support through Amazon’s accommodations page. If your country or region is not listed in the portal, contact your Recruiting Partner directly.

Official Website

Apply and read the full role details on the official page: Annapurna Labs ASIC Engineer Intern 2027 on amazon.jobs.

Filed Under: Internships

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